Job Location: Bangalore
Experience: 6-10 years
Experience with IC Package Design using Allegro Package Designer (APD), IC Package Design experience.
Good understanding of package/substrate design and package assembly rules related to flip chip designs.
Exposure to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D etc., added advantage.
Expertise in High Speed Complex Package designs with HDI, Blind and Buried Via technologies.
Hands-on expertise with PCB designs involving High Speed Parallel Bus interfaces including DDR, GDDR, LPDDR and HSIO interfaces including PCIe, SERDES.
Good Exposure to Stackup design, DFM, DFA rules and adherence.
Should have expertise in constraint setting in layout tool.